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Microwave communication ceramic gold-plated plate

Microwave communication ceramic gold-plated plate

Your trusted expert in thick film circuit and sensor manufacturing.
Years of technological accumulation.

  • Customized Provide customized services
  • Surface treatment Support surface treatment processes such as nickel palladium plating, sputtered copper, electroplated copper, etc
  • Operating Temperature -55℃~850℃
  • Thermal conductivity Aluminum oxide 24-28W/(m · K), aluminum nitride 170-230W/m · K

advantages

Five advantages to provide you with a good user experience.

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Multiple product certifications

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Exquisite craftsmanship

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Lightweight

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Small size

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Long service life

feature

☑ Surface gold plating treatment can enhance oxidation resistance and conductivity, and has strong corrosion resistance.
☑ Increase the reliability of solder joints and apply gold wire bonding technology.
☑ Crafted with ingenuity, the choice of quality.

Product scope of application

Microwave communication ceramic gold-plated board refers to a high-frequency circuit substrate made of microwave ceramic materials. It is usually made by precision machining high-performance ceramic substrates such as alumina and aluminum nitride, and depositing a layer of high-purity gold on their surface through processes such as sputtering and electroplating. Microwave ceramic materials have excellent characteristics such as high dielectric constant, high quality factor, and good temperature stability, and are therefore widely used in high-frequency circuit fields such as microwave communication, radar, satellite communication, and antennas. The dielectric constant of microwave ceramic substrates is usually between 5 and 15, with a quality factor between 10000 and 100000. They have low dielectric loss and good frequency stability, making them suitable for the production of high-frequency circuits. As a key core material in the field of microwave and radio frequency, it is necessary to strictly control parameters such as plating solution composition and current density to ensure uniform coating thickness and avoid increased signal transmission loss. Especially in the aerospace industry, which is sensitive to material weight, it is necessary to optimize the thickness of the gold plating layer to reduce the overall weight.

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Product parameter

Product name

Microwave communication ceramic gold-plated plate

Customized

Provide customized services

Functional materials

High pressure resistant materials such as 99 alumina, aluminum nitride, beryllium oxide, etc

Surface treatment

Support surface treatment processes such as nickel palladium plating, sputtered copper, electroplated copper, etc

Operating Temperature

-55℃~850℃

Thermal conductivity

Aluminum oxide 24-28W/(m · K), aluminum nitride 170-230W/m · K

Storage conditions

Temperature 5 ℃~35 ℃, relative humidity ≤ 75% RH

Application Cases

Microwave devices: used to manufacture high-frequency components such as filters and couplers, improving signal transmission efficiency and stability.
5G base station: It can achieve low loss transmission of millimeter wave signals and reduce base station energy consumption.
Aerospace: Due to the high temperature stability and radiation resistance of gold plating, it is used in key electronic components such as satellite communication and navigation systems.
New energy vehicles: The power semiconductor module adopts a gold-plated ceramic substrate, optimizing the heat dissipation performance of IGBT and SiC modules, and improving the efficiency of the electronic control system.

With the rapid development of modern communication technology, the special requirements for the use of communication equipment have led to increasingly high demands for the weight and size of communication system equipment, especially for the miniaturization, lightweight, high-frequency, and low-power requirements of filters in mobile communication systems. The application of microwave communication ceramic gold-plated plates in high-tech industries is becoming increasingly widespread.
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