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High-Quality Electronic Communication PCB Ceramic Gold-Plated Boards - Trusted China Suppliers & Factory for Thick Film Circuits
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High-Quality Electronic Communication PCB Ceramic Gold-Plated Boards - Trusted China Suppliers & Factory for Thick Film Circuits

As a leading manufacturer in China, we specialize in thick film circuit and sensor production. With years of technological expertise and dedication, we are recognized among top suppliers in the industry. Our factory is equipped with advanced technology, ensuring high-quality products that meet your specific needs. Trust us for reliable solutions in thick film circuits and sensors
  • Customized Provide customized services
  • Surface treatment Support surface treatment processes such as nickel palladium plating, sputtered copper, electroplated copper, etc
  • Operating Temperature -55℃~850℃
  • Thermal conductivity Aluminum oxide 24-28W/(m · K), aluminum nitride 170-230W/m · K

advantages

Five advantages to provide you with a good user experience.

Multiple product certifications

Multiple product certifications

Exquisite craftsmanship

Exquisite craftsmanship

Lightweight

Lightweight

Small size

Small size

Long service life

Long service life

feature

Using ceramic substrate, it combines high thermal conductivity, low coefficient of expansion, and high mechanical strength.
The gold plating layer can ensure long-term stable conductivity, oxidation resistance, and welding reliability.
Crafted with ingenuity, the choice of quality.

Product scope of application

The electronic communication PCB ceramic gold-plated board has high-frequency and high-speed performance: the ceramic substrate has low dielectric constant and low dielectric loss, and the gold-plated layer has low contact resistance, effectively reducing signal attenuation and crosstalk, and is suitable for high-speed communication protocols such as 5G and satellite communication. The high thermal conductivity of ceramic materials quickly dissipates heat, and the gold plating layer assists in heat conduction, ensuring long-term stable operation of electronic components and improving the reliability of communication equipment. The gold plating layer has strong resistance to oxidation and corrosion, which can extend the service life of the product and adapt to complex industrial environments such as humidity and dust. And it supports irregular structures (such as sectors, circles) or multi-layer designs, meeting the layout requirements of compact internal space and modular functionality of electronic communication devices.
Ceramic gold-plated board detail 4
Ceramic gold-plated board detail 3
Ceramic gold-plated board detail 2
Ceramic gold-plated board detail 5
Ceramic gold-plated board detail 1

Product parameter

Product name Electronic communication PCB ceramic gold-plated board
Customized Provide customized services
Functional materials High pressure resistant materials such as 99 alumina, aluminum nitride, beryllium oxide, etc
Surface treatment Support surface treatment processes such as nickel palladium plating, sputtered copper, electroplated copper, etc
Operating temperature -55℃~850℃
Thermal conductivity Aluminum oxide 24-28W/(m · K), aluminum nitride 170-230W/m · K
Storage conditions Temperature 5 ℃~35 ℃, relative humidity ≤ 75% RH

Application Cases

High frequency communication module

Applied in high-frequency scenarios such as 5G base stations and satellite communications, the low dielectric constant of ceramic substrates and the low contact resistance of gold plating layers ensure signal transmission efficiency and stability.

Power management module

Used for power converters, chargers, etc., ceramic substrates with high thermal conductivity to assist heat dissipation, and gold plating with high voltage resistance to adapt to high-power circuits.

Medical electronic devices

Such as in vitro diagnostic instruments and monitoring equipment, the biocompatibility of ceramic substrates (for certain ceramic materials) and the corrosion resistance of gold-plated layers meet the high reliability requirements of medical applications.

Consumer electronics accessories

Such as smart watches, AR glasses and other miniaturized devices, with shaped ceramic gold-plated PCBs adapted to compact structures, ensuring stability in signal transmission and power management.

Industrial Internet of Things Gateway

As the core circuit board for data transmission, the high-frequency and high-speed performance and customized structure of ceramic gold-plated boards meet the communication needs of large bandwidth and low latency in industrial scenarios.

Application Cases Image

Frequently Asked Questions

What are the primary substrate materials used for these ceramic boards?

We utilize high pressure resistant functional materials, including 99 alumina, aluminum nitride, and beryllium oxide, to meet different performance requirements.

What is the thermal conductivity range of the ceramic substrates?

The thermal conductivity varies by material: Aluminum oxide provides 24-28 W/(m · K), while aluminum nitride offers high-performance heat dissipation at 170-230 W/m · K.

What operating temperatures can these ceramic gold-plated PCBs withstand?

These boards are designed to perform reliably in extreme environments, with an operating temperature range of -55℃ to 850℃.

What surface treatment processes do you support?

We support various advanced surface treatments, including nickel palladium plating, sputtered copper, and electroplated copper, to ensure optimal conductivity and oxidation resistance.

Do you offer customization for irregular shapes and structures?

Yes, we provide fully customized services. Our boards support irregular structures (such as sectors, circles) and multi-layer designs to accommodate compact and modular configurations.

What are the recommended storage conditions for these PCBs?

To maintain optimal quality, the boards should be stored in a temperature range of 5℃ to 35℃, with a relative humidity level of ≤ 75% RH.