High-Performance AlN Thick Film Gold Paste Ceramic Circuit Board BH006A0 - China Suppliers & Factory
Product Details
The BH006A0 is a high-performance 2-layer aluminum nitride (AlN) thick film gold paste ceramic circuit board, engineered for demanding high-frequency and high-power applications. Utilizing advanced thick film gold conductor printing and through-hole via interconnection technology, this circuit board delivers exceptional thermal management and electrical reliability. With a board thickness of 1.0mm and thermal conductivity exceeding 170 W/m·K, the BH006A0 excels in heat dissipation, making it the ideal substrate solution for microwave communication modules, RF power amplifiers, and high-temperature electronic systems.
The thick film gold paste printing process ensures uniform conductor trace thickness, excellent bonding strength, and superior oxidation resistance. Combined with precision laser-trimmed resistors and gold wire bonding capability, the BH006A0 provides a robust platform for hybrid microcircuits and multi-chip modules where performance and reliability are non-negotiable.
Advantages
High Thermal Conductivity
AlN substrate with thermal conductivity >170 W/m·K ensures rapid heat dissipation for high-power circuits.
Superior Gold Conductors
Thick film gold paste traces offer excellent conductivity, oxidation resistance, and reliable wire bonding.
Precision Through-Hole Vias
Advanced via technology enables reliable inter-layer connections and compact circuit design.
High-Temperature Stability
AlN ceramic maintains stable electrical and mechanical properties across a wide operating temperature range.
Customizable Design
Flexible layout options with customizable trace patterns, resistor values, and via configurations.
Features
- 2-layer aluminum nitride (AlN) ceramic substrate with thermal conductivity >170 W/m·K
- Thick film gold paste conductor printing for high conductivity and oxidation resistance
- Through-hole via technology for reliable inter-layer electrical connections
- Suitable for gold wire bonding and flip-chip assembly
- Board thickness: 1.0mm, compact and lightweight design
- Excellent high-frequency performance with low dielectric loss
- Laser-trimmed thick film resistors available for precision applications
- Wide operating temperature range suitable for harsh environments
Product Description
The BH006A0 aluminum nitride (AlN) thick film gold paste ceramic circuit board represents the cutting edge of ceramic substrate technology for advanced electronic applications. Aluminum nitride is a premier ceramic material known for its outstanding thermal conductivity — exceeding 170 W/m·K — combined with a coefficient of thermal expansion (CTE) closely matched to silicon, making it the substrate of choice for high-power semiconductor packaging and hybrid microelectronics.
Our thick film gold paste printing process deposits high-purity gold conductor traces directly onto the AlN substrate through precision screen printing, followed by high-temperature firing. This creates mechanically robust, chemically stable conductors that resist oxidation even at elevated temperatures. The gold conductors support gold wire bonding, a critical requirement for hermetic packaging in military, aerospace, and telecommunications applications where long-term reliability is essential.
The 2-layer design with through-hole vias enables more complex circuit routing compared to single-layer solutions. Via holes are metallized with gold or silver-palladium conductors, providing low-resistance vertical interconnects between the top and bottom circuit layers. This architecture supports higher component density and more sophisticated circuit functions while maintaining the superior thermal management of the AlN substrate.
At 1.0mm thickness, the BH006A0 strikes an optimal balance between mechanical strength and thermal performance. The board is suitable for direct attachment of bare semiconductor die, SMD components, and wire-bonded devices. Its compact form factor and excellent thermal characteristics make it ideal for space-constrained, high-power-density applications.
Product Parameters
| Parameter | Specification |
|---|---|
| Product Model | BH006A0 |
| Substrate Material | Aluminum Nitride (AlN) |
| Number of Layers | 2 |
| Board Thickness | 1.0 mm |
| Thermal Conductivity | >170 W/m·K |
| Conductor Material | Thick Film Gold Paste (Au) |
| Via Technology | Through-Hole Via (Au/AgPd Metallization) |
| Conductor Thickness | 10-15 μm (Typical) |
| Minimum Line Width/Space | 150 μm / 150 μm |
| Surface Finish | Gold (Thick Film) |
| Assembly Compatibility | Gold Wire Bonding, SMD, Epoxy Die Attach |
| Operating Temperature | -55°C to +300°C |
| Customization | Available — Contact for Specifications |
| Storage Conditions | Temperature 5°C~35°C, Relative Humidity ≤75% RH |
Application Cases
With the continuous advancement of high-frequency communication, power electronics, and miniaturized system design, aluminum nitride ceramic circuit boards are increasingly becoming the substrate of choice for engineers seeking the optimal balance of thermal performance, electrical reliability, and mechanical stability. The BH006A0 delivers this balance with proven thick film gold paste technology.
Free Consulting Service
We are willing to cooperate wholeheartedly with customers from all industries. New and existing customers are welcome to contact us for technical consultation, custom design support, and sample requests. All staff at Jianchuang Electronics are dedicated to providing professional solutions and look forward to building successful partnerships.