Dongguan Jianchuang Electronic Technology Co., Ltd. 

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China Suppliers for High-Quality Electronic Communication PCB Ceramic Gold-Plated Circuit Factory
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China Suppliers for High-Quality Electronic Communication PCB Ceramic Gold-Plated Circuit Factory

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Discover reliable suppliers from China specializing in thick film circuit and sensor manufacturing. With years of technological expertise, our factory is dedicated to delivering high-quality solutions that meet your needs.

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  • Customized Provide customized services
  • Surface treatment Support surface treatment processes such as nickel palladium plating, sputtered copper, electroplated copper, etc
  • Operating Temperature -55℃~850℃
  • Thermal conductivity Aluminum oxide 24-28W/(m · K), aluminum nitride 170-230W/m · K

advantages

Five advantages to provide you with a good user experience.

Multiple product certifications

Multiple product certifications

Exquisite craftsmanship

Exquisite craftsmanship

Lightweight

Lightweight

Small size

Small size

Long service life

Long service life

feature

Using ceramic substrate, it combines high thermal conductivity, low coefficient of expansion, and high mechanical strength.
The gold plating layer can ensure long-term stable conductivity, oxidation resistance, and welding reliability.
Crafted with ingenuity, the choice of quality.

Product scope of application

The electronic communication PCB ceramic gold-plated board has high-frequency and high-speed performance: the ceramic substrate has low dielectric constant and low dielectric loss, and the gold-plated layer has low contact resistance, effectively reducing signal attenuation and crosstalk, and is suitable for high-speed communication protocols such as 5G and satellite communication. The high thermal conductivity of ceramic materials quickly dissipates heat, and the gold plating layer assists in heat conduction, ensuring long-term stable operation of electronic components and improving the reliability of communication equipment. The gold plating layer has strong resistance to oxidation and corrosion, which can extend the service life of the product and adapt to complex industrial environments such as humidity and dust. And it supports irregular structures (such as sectors, circles) or multi-layer designs, meeting the layout requirements of compact internal space and modular functionality of electronic communication devices.

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Product parameter

Product name Electronic communication PCB ceramic gold-plated board
Customized Provide customized services
Functional materials High pressure resistant materials such as 99 alumina, aluminum nitride, beryllium oxide, etc
Surface treatment Support surface treatment processes such as nickel palladium plating, sputtered copper, electroplated copper, etc
Operating temperature -55℃~850℃
Thermal conductivity Aluminum oxide 24-28W/(m · K), aluminum nitride 170-230W/m · K
Storage conditions Temperature 5 ℃~35 ℃, relative humidity ≤ 75% RH

Application Cases

High frequency communication module: applied in high-frequency scenarios such as 5G base stations and satellite communications, the low dielectric constant of ceramic substrates and the low contact resistance of gold plating layers ensure signal transmission efficiency and stability.
Power management module: used for power converters, chargers, etc., ceramic substrates with high thermal conductivity to assist heat dissipation, and gold plating with high voltage resistance to adapt to high-power circuits.
Medical electronic devices: such as in vitro diagnostic instruments and monitoring equipment, the biocompatibility of ceramic substrates (for certain ceramic materials) and the corrosion resistance of gold-plated layers meet the high reliability requirements of medical applications.
Consumer electronics accessories: such as smart watches, AR glasses and other miniaturized devices, with shaped ceramic gold-plated PCBs adapted to compact structures, ensuring stability in signal transmission and power management.
Industrial Internet of Things Gateway: As the core circuit board for data transmission, the high-frequency and high-speed performance and customized structure of ceramic gold-plated boards meet the communication needs of large bandwidth and low latency in industrial scenarios.
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Frequently Asked Questions (FAQ)

What are the main advantages of this ceramic gold-plated board?

It features multiple product certifications, exquisite craftsmanship, lightweight design, small size, and a long service life, ensuring a reliable user experience.

What functional materials are used in the substrate?

The board utilizes high pressure resistant materials such as 99 alumina, aluminum nitride, and beryllium oxide to achieve optimal thermal conductivity and mechanical strength.

What surface treatment processes are supported?

It supports several surface treatments including nickel palladium plating, sputtered copper, and electroplated copper, which ensure stable conductivity and oxidation resistance.

What is the operating temperature range of the board?

The board is designed to operate reliably in extreme environments, with an operating temperature range from -55℃ to 850℃.

How does the ceramic substrate improve high-frequency performance?

The ceramic substrate has a low dielectric constant and low dielectric loss, which combined with the low contact resistance of the gold-plated layer, effectively reduces signal attenuation and crosstalk in protocols like 5G and satellite communications.

Can the board be customized for compact or irregular layouts?

Yes, it supports customized designs including irregular structures (such as sectors or circles) and multi-layer layouts to meet the compact space demands of modern electronic devices.