China Ceramic Thick Film Heat Dissipation Plate for LED Lighting - Trusted Supplier and Factory Solution
Advantages
Multiple product certifications
Exquisite craftsmanship
Lightweight
Small size
Long service life
Feature
- ☑ Has anti oxidation and anti sulfurization properties.
- ☑ Suitable for multi grain packaging COB process or flip chip process.
- ☑ Crafted with ingenuity, the choice of quality.
Product scope of application
Product parameter
| Product name | Ceramic thick film heat dissipation plate for LED lighting |
| Customized | Provide customized services |
| Working temperature range | -50°C~+350°C |
| Key materials | AL2O3 Aluminum oxide or AIN high-performance precision ceramics |
| Functional materials | High performance/Ag/Pd/Pt/Cu/Au imported conductor material with strong adhesion |
| Thermal conductivity | AL2O3 17~30W/m.k; ALN 90~220W/m.k; |
| reflectivity | More than 90% |
| Maximum luminous efficiency | ≥150Lm/W |
| Product Usage | Ceramic thick film circuit board specially designed for various high-power LED lighting applications |
Application Cases
Frequently Asked Questions
What are the primary benefits of using ceramic thick film heat dissipation plates for LED lighting?
They offer exceptional thermal conductivity, superior heat dissipation performance, excellent insulation, and high corrosion resistance. These features significantly extend the service life and enhance the luminous efficiency of high-power LED chips.
Can these ceramic heat dissipation plates be customized according to specific requirements?
Yes, we provide fully customized services to design and manufacture ceramic thick film circuit boards tailored to your specific dimensional, material, and layout needs.
What base and functional materials are used in these plates?
The key base materials are AL2O3 (Aluminum Oxide) or AlN (Aluminum Nitride) high-performance precision ceramics. The functional conductor layers are made of high-quality imported conductor materials like Ag, Pd, Pt, Cu, and Au, ensuring strong adhesion and conductivity.
What is the operating temperature range of these ceramic plates?
These plates are designed to withstand extreme thermal conditions, with a reliable working temperature range spanning from -50°C up to +350°C.
Are these heat dissipation plates suitable for COB and flip chip processes?
Yes, they are highly suitable for multi-grain packaging COB (Chip-on-Board) processes and flip-chip processes, offering excellent anti-oxidation and anti-sulfurization properties to ensure process stability.
In which applications are these ceramic thick film plates most commonly used?
They are ideal for high-power LED lighting fields, including special industrial lighting, stage lighting, outdoor engineering lighting, and other high-brightness scenarios that require robust thermal management.