Ceramic thick film heat dissipation plate for LED lighting
advantages
Five advantages to provide you with a good user experience.
Multiple product certifications
Exquisite craftsmanship
Lightweight
Small size
Long service life
feature
☑ Has anti oxidation and anti sulfurization properties.
☑ Suitable for multi grain packaging COB process or flip chip process.
☑ Crafted with ingenuity, the choice of quality.
Product scope of application
Ceramic thick film heat dissipation plates for LED lighting are suitable for high-power LED lighting fields, such as special lighting, outdoor lighting engineering, and other scenarios. Ceramic thick film heat dissipation plates can greatly enhance the service life and efficiency of LED chips due to their excellent thermal conductivity, heat dissipation performance, insulation, and corrosion resistance. In special occasions that require high brightness and high efficiency lighting, such as industrial lighting, stage lighting, etc.
Product parameter
Product name |
Ceramic thick film heat dissipation plate for LED lighting |
Customized |
Provide customized services |
Working temperature range |
-50°C~+350°C |
Key materials |
AL2O3 Aluminum oxide or AIN high-performance precision ceramics |
Functional materials |
High performance/Ag/Pd/Pt/Cu/Au imported conductor material with strong adhesion |
Thermal conductivity |
AL2O317~30W/m.k;ALN90~220W/m.k; |
reflectivity |
More than 90% |
Maximum luminous efficiency |
≥150Lm/W |
Product Usage |
Ceramic thick film circuit board specially designed for various high-power LED lighting applications |
Application Cases
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